spec no: dsac0235 rev no: v.1 date: nov/12/2002 page: 1 of 4 approved : j. lu checked :allen liu drawn: x.t.hu 2.0x1.25mm smd chip led lamp notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.1(0.004") unless otherwise noted. 3. specifications are subject to change without notice. features ! 2.0mmx1.25mm smt led, 0.75mm thickness. ! low power consumption. ! wide viewing angle. ! ideal for backlight and indicator. ! various colors and lens types available. ! package : 2000pcs / reel. package dimensions APTK2012PBC blue description the blue source color devices are made with ingan on sic light emitting diode.
spec no: dsac0235 rev no: v.1 date: nov/12/2002 page: 2 of 4 approved : j. lu checked :allen liu drawn: x.t.hu electrical / optical characteristics at t a =25 c absolute maximum ratings at t a =25 c note: 1. 1/10 duty cycle, 0.1ms pulse width. selection guide note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. l o b m y sl o b m y s l o b m y s l o b m y sl o b m y sr e t e m a r a pr e t e m a r a p r e t e m a r a p r e t e m a r a pr e t e m a r a pe c i v e de c i v e d e c i v e d e c i v e de c i v e d. p y t. p y t . p y t . p y t. p y t. x a m. x a m . x a m . x a m. x a ms t i n us t i n u s t i n u s t i n us t i n us n o i t i d n o c t s e ts n o i t i d n o c t s e t s n o i t i d n o c t s e t s n o i t i d n o c t s e ts n o i t i d n o c t s e t k a e p h t g n e l e v a w k a e pe u l b8 6 4m ni f a m 0 2 = d h t g n e l e v a w e t a n i m o de u l b0 7 4m ni f a m 0 2 = ? 2 / 1 h t d i w - f l a h e n i l l a r t c e p se u l b5 2m ni f a m 0 2 = ce c n a t i c a p a ce u l b5 6f pv f z h m 1 = f ; v 0 = v f e g a t l o v d r a w r o fe u l b5 6 . 32 . 4v i f a m 0 2 = i r t n e r r u c e s r e v e re u l b0 1a uv r v 5 = r e t e m a r a pr e t e m a r a p r e t e m a r a p r e t e m a r a pr e t e m a r a p e u l be u l b e u l b e u l be u l bs t i n us t i n u s t i n u s t i n us t i n u n o i t a p i s s i d r e w o p 2 0 1w m t n e r r u c d r a w r o f c d 0 3a m ] 1 [ t n e r r u c d r a w r o f k a e p 0 6 1a m e g a t l o v e s r e v e r 5v e r u t a r e p m e t e g a r o t s / g n i t a r e p o 0 4 - 5 8 + o t c c . o n t r a p. o n t r a p . o n t r a p . o n t r a p. o n t r a pe c i de c i d e c i d e c i de c i de p y t s n e le p y t s n e l e p y t s n e l e p y t s n e le p y t s n e l ) d c m ( v i) d c m ( v i ) d c m ( v i ) d c m ( v i) d c m ( v i a m 0 2 @ g n i w e i vg n i w e i v g n i w e i v g n i w e i vg n i w e i v e l g n a . n i m. n i m . n i m . n i m. n i m. p y t. p y t . p y t . p y t. p y t 2 / 1 22 / 1 2 2 / 1 2 2 / 1 22 / 1 2 c b p 2 1 0 2 k t p a) n a g n i ( e u l br a e l c r e t a w6 30 6 0 0 1
spec no: dsac0235 rev no: v.1 date: nov/12/2002 page: 3 of 4 approved : j. lu checked :allen liu drawn: x.t.hu blue APTK2012PBC
spec no: dsac0235 rev no: v.1 date: nov/12/2002 page: 4 of 4 approved : j. lu checked :allen liu drawn: x.t.hu recommended soldering pattern (units : mm) tape specifications (units : mm) APTK2012PBC smt reflow soldering instructions number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
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